Oracle's Hardware Development Organization seeks to add an experienced Lead Thermal Mechanical Design Engineer with specific experience in Liquid Cooling to work within its Server Development team in Santa Clara, California. As a member of this design team, you will have the opportunity to lead the thermal architecture of the next state of the art server generations for various Oracle programs, including cloud applications. 

As a Lead Thermal Engineer, you will focus on the alignment of liquid cooling thermal hardware design with data center physical infrastructure.  A knowledgeable engineer with extensive hands-on work experience on the latest data center liquid cooling technology and approaches practiced within the industry. A mix of technical breadth and depth is required to work cross-functionally with different multiple disciplines (Mechanical, Electrical, Thermal, and Software) to develop and set liquid cooling strategies and actual HW setup that are optimized for the entire rack. You will need to work with internal and external partners, and focus on design, development, manufacturing, and deployment of the next generation of world class liquid cooled hardware. 

Career Level - IC4