Responsibilities:
• Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
• Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
• Guide the team in connector design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement.
• Create actionable recommendations based upon design reviews and simulation results.
• Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community.
• Align the technology roadmap with the market trends, customer needs, and implement accordingly.
• Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions.
• Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures.
• Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.
Skills/Experience:
• Bachelor’s degree in Electrical Engineering or equivalent work experience; Master's Degree preferred
• Generally requires 10 years of relevant work experience in electrical Design, RF design or PCB design
• Generally requires a minimum of 3 years of progressive leadership and people management experience in a regional environment
• Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
• Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
• Proficient with high-speed test equipment (VNA, TDR, BERT)
• Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration
• Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
• Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
• Exposure to physical layer communications systems and architectures.
• Fluent in English (both verbal and written)
• Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
• Expert problem solver – able to solve high complexity situations with little to no direction. Proactive in identifying complex issues, providing solutions, and driving improvements to evolve procedures
• Proficient in presenting technical solutions to customers and upper management